October 19, 2020

Tag: Aerospace

automotive

Worldwide Engineering Adhesives Industry to 2025 – Growing Demand from Automotive and Aerospace Sectors

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DUBLIN–(BUSINESS WIRE)–Oct 14, 2020–

The “Engineering Adhesives Market – Growth, Trends, and Forecast (2020 – 2025)” report has been added to ResearchAndMarkets.com’s offering.

The market for engineering adhesives is expected to grow at a CAGR of more than 3% globally during the forecast period.

Growing demand from manufacturing industries and increasing applications for industrial purposes are driving the market growth. The outbreak of COVID-19 and volatility in raw material prices are expected to hinder the market growth.

Companies Mentioned

  • 3M

  • Arkema S. A

  • Ashland Global Specialty Chemicals Inc

  • Dow Corning Corporation

  • Dymax Corporation

  • H.B. Fuller

  • Henkel AG & Co. KGaA

  • Huntsman International LLC

  • Permabond LLC

  • Sika AG

Key Market Trends

Growing Demand from Automotive and Aerospace Sectors

  • Engineering Adhesives are majorly used for engineering applications. The demand for engineering adhesives has been growing from the manufacturing industries such as automotive, electronics, renewable energy sector, and also from other advanced engineering
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automotive

Microchip Expands Solutions for Aerospace and Defense, Industrial and Automotive Applications …

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Press release content from Globe Newswire. The AP news staff was not involved in its creation.

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CHANDLER, Ariz., Sept. 30, 2020 (GLOBE NEWSWIRE) — System designers have limited options for small, robust, feature-rich high-speed ADCs for extended-temperature operation. Microchip Technology Inc. (Nasdaq: MCHP) today announced it has filled this gap with its MCP37Dx1-80 family, the company’s second pipelined ADC offering and first to combine 80 MSPS in a choice of 12-, 14- and 16-bit resolutions, integrated digital features and qualification to a higher temperature range, including Automotive Electronics Council (AEC) Q100. 

“Our latest ADCs meet growing customer demand for robust devices that can be used in high-temperature applications and offer integrated digital processing functions that simplify design and reduce overall development costs,” said Bryan Liddiard, Vice President, Mixed-Signal and Linear division at Microchip. “The MCP37Dx1-80 family joins Microchip’s 200 MSPS ADCs to expand our high-speed offering

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